multiphysics multiple physical coupling simulation software Search Results


multiphysics multiple physical coupling simulation software  (COMSOL Inc)
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COMSOL Inc multiphysics multiple physical coupling simulation software
Multiphysics Multiple Physical Coupling Simulation Software, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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comsol multiphysics  (COMSOL Inc)
90
COMSOL Inc comsol multiphysics
Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multi-physics coupling simulation software comsol multiphysics 5.5  (COMSOL Inc)
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COMSOL Inc multi-physics coupling simulation software comsol multiphysics 5.5
Multi Physics Coupling Simulation Software Comsol Multiphysics 5.5, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multi-physical ̄eld simulation software comsol multiphysics 5.5  (COMSOL Inc)
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COMSOL Inc multi-physical ̄eld simulation software comsol multiphysics 5.5
Multi Physical ̄eld Simulation Software Comsol Multiphysics 5.5, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics  (COMSOL Inc)
90
COMSOL Inc multiphysics
Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics 5.6 optical wave optics module  (COMSOL Inc)
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COMSOL Inc multiphysics 5.6 optical wave optics module
Multiphysics 5.6 Optical Wave Optics Module, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics simulations  (ANSYS inc)
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ANSYS inc multiphysics simulations
Multiphysics Simulations, supplied by ANSYS inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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fsi interface  (COMSOL Inc)
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COMSOL Inc fsi interface
Fsi Interface, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics platform comsolmultiphysics  (COMSOL Inc)
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COMSOL Inc multiphysics platform comsolmultiphysics
Multiphysics Platform Comsolmultiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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multiphysics heat transfer simulations  (COMSOL Inc)
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COMSOL Inc multiphysics heat transfer simulations
COMSOL <t>Multiphysics</t> 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).
Multiphysics Heat Transfer Simulations, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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2d finite element method (fem) simulation model  (COMSOL Inc)
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COMSOL Inc 2d finite element method (fem) simulation model
COMSOL <t>Multiphysics</t> 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).
2d Finite Element Method (Fem) Simulation Model, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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spectral simulations comsol multiphysics  (COMSOL Inc)
90
COMSOL Inc spectral simulations comsol multiphysics
COMSOL <t>Multiphysics</t> 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).
Spectral Simulations Comsol Multiphysics, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
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COMSOL Multiphysics 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).

Journal: Micromachines

Article Title: Disposable DNA Amplification Chips with Integrated Low-Cost Heaters †

doi: 10.3390/mi11030238

Figure Lengend Snippet: COMSOL Multiphysics 5.3a finite element method heat transfer simulations of a 0.75 mm deep chamber with different heater widths and heater spacings. Panel ( a ) shows the schematics with the materials indicated in the figure and the heaters exaggerated in red (they are 1 dimensional lines in the simulation model). Panel ( b ) shows the case for 0.3 mm heater width and 0.3 mm heater spacing. Panel ( c ) shows the case for 0.3 mm heater width and 2.0 mm heater spacing. The scale bar in panel ( d ) is in °C and applies to both panels ( b ) and ( c ).

Article Snippet: Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips.

Techniques:

Three temperature differences within the system. In panel ( a ) the Δ T top of chamber , in panel ( b ) the Δ T across chamber , in panel ( c ) the Δ T bottom of chamber , and in panel ( d ) the Δ T deviation from set T are shown for different heater widths (0.3 mm to 2.0 mm, in the columns) and heater spacings (0.3 mm to 2.0 mm, in the rows). The differences are obtained using a parametric sweeps for both the heater width and heater spacing in the COMSOL Multiphysics 5.3a finite element method heat transfer simulations. The cells in dark indicate the smallest Δ T and the cells in white the largest Δ T .

Journal: Micromachines

Article Title: Disposable DNA Amplification Chips with Integrated Low-Cost Heaters †

doi: 10.3390/mi11030238

Figure Lengend Snippet: Three temperature differences within the system. In panel ( a ) the Δ T top of chamber , in panel ( b ) the Δ T across chamber , in panel ( c ) the Δ T bottom of chamber , and in panel ( d ) the Δ T deviation from set T are shown for different heater widths (0.3 mm to 2.0 mm, in the columns) and heater spacings (0.3 mm to 2.0 mm, in the rows). The differences are obtained using a parametric sweeps for both the heater width and heater spacing in the COMSOL Multiphysics 5.3a finite element method heat transfer simulations. The cells in dark indicate the smallest Δ T and the cells in white the largest Δ T .

Article Snippet: Based on the analysis of the milling process, metal adhesion studies, and COMSOL MultiPhysics heat transfer simulations, the first batch of chips has been fabricated and successful multiple displacement amplification reactions are performed inside these chips.

Techniques: